电子元器件粘接用蜡

Electronic components bonding wax

用途：应用于各种晶片、精密玻璃及金属类加工过程中的粘接。 Application : Used for bonding in machining process for all kinds of chip . precision glass and metal

特点：具有快速、强有力的粘接性能，热稳定性好，熔融温度低，无毒害，无杂质，无腐蚀性，易于被有机溶剂充分溶解和清洗。 Features : With fast and strong bond capability , good thermal stability . low melting temperature , no poison , no impurities , no corrosion , easy dissolving and cleaning by organic solvent